New 3D Vapor Chamber
Built for Power. Cooled by Silence. Designed for the AI Era. It's here — our coolest innovation yet! When your server is working hard & hot, we make sure it stays cool & quiet. #AiSolutions is proud to introduce the AISVC05-5008, a fanless, passive heat sink built for next-gen platforms, supporting a minimum of 350W TDP. Whether it's in a data center or at the edge, this compact thermal beast gets the job done — without making a sound.
Key Technical Features: • 3D Vapor Chamber: One-piece vacuum brazed construction for near-isothermal performance • Porous Aluminum Powder Base: Enhances thermal conductivity and structural stability • Flat Tubes + Fin Structure: Minimizes thermal resistance, improves air-side heat exchange • 2U to 4U Compatibility: Flexible integration across different server heights • Easy to replace, with a lifespan of over 10 years • Customizable Design Options: Including threaded holes, through-holes, steps, and cutouts
Visit us for more information :
#AI #CPU #GPU #intel #NVIDIA #LGA4677 #server #cooler #thermal #solutions #VC |
